Wednesday, June 1st, 2016

According to researcher, the Global Thermal Interface Materials market accounted for $570 million in 2015 and is expected to grow up to $1,186 million by 2022 growing at a CAGR of 11.03% from 2015 to 2022. The increasing LED market, better connectivity, stylish electronics electrification of transport are the factors that are driving the market growth. However, physical properties are one of the factors hindering the market growth. The major market share is captured by computer segment with electronic systems becoming faster, hotter, more compact, and portable, the need for better TIMs in consumer and industrial computing will continue. 


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Greases & Adhesives segment is the dominating material market. Asia Pacific region is the largest and fastest growing market for greases & adhesives segment. Thermal grease is used to fill gaps between power devices and heat sinks and they remain popular in consumer electronics and industrial computing. Asia Pacific region leads the market globally with the biggest market share and is expected to grow at a high CAGR among the other regions. In Asia Pacific, China, Japan, South Korea, and India are the leading markets for Thermal Interface Materials. 

Some of the key players in the global market include Henkel AG & Co. KGAA, DOW Corning Corporation, 3M Company, Parker Hannifin Corporation, Honeywell International Inc., Indium Corporation, Momentive Performance Materials Inc., The Bergquist Company, Inc., Laird Technologies, Inc., Zalman Tech Co., Ltd., Fujipoly, Graftech International Holdings Inc., Stockwell Elastomerics, Inc., Wakefield-Vette, Inc., and MH&W International. 


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Thermal Interface material types covered: 
• Thermal Pads 
• Thermal Grease 
• Phase Change Material 
• Gaps Fillers 
• Metal-Based TIMs 
• Greases & Adhesives 
Products covered: 
• Power Transistors 
• Thyristor 
• Mosfet 

Application Covered: 
• Power supply units 
• Consumer Electronics 
• Telecom Equipment 
• Industrial Machinery 
• Automotive Electronics 
• Computers 
• Medical Devices 
• Others 

Regions Covered: 
• North America 
o US 
o Canada 
o Mexico 
• Europe 
o Germany 
o France 
o Italy 
o UK 
o Spain 
o Rest of Europe 
• Asia Pacific 
o Japan 
o China 
o India 
o Australia 
o New Zealand 
o Rest of Asia Pacific 
• Rest of the World 
o Middle East 
o Brazil 
o Argentina 
o South Africa 
o Egypt 

What our report offers: 
- Market share assessments for the regional and country level segments 
- Market share analysis of the top industry players 
- Strategic recommendations for the new entrants 
- Market forecasts for a minimum of 7 years of all the mentioned segments, sub segments and the regional markets 
- Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations) 
- Strategic recommendations in key business segments based on the market estimations 
- Competitive landscaping mapping the key common trends 
- Company profiling with detailed strategies, financials, and recent developments 
- Supply chain trends mapping the latest technological advancements


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Table of content

1 Executive Summary 

2 Preface 
2.1 Abstract 
2.2 Stake Holders 
2.3 Research Scope 
2.4 Research Methodology 
2.4.1 Data Mining 
2.4.2 Data Analysis 
2.4.3 Data Validation 
2.4.4 Research Approach 
2.5 Research Sources 
2.5.1 Primary Research Sources 
2.5.2 Secondary Research Sources 
2.5.3 Assumptions 

3 Market Trend Analysis 
3.1 Introduction 
3.2 Drivers 
3.3 Restraints 
3.4 Opportunities 
3.5 Threats 
3.6 Product Analysis 
3.7 Application Analysis 

4 Porters Five Force Analysis 
4.1 Bargaining power of suppliers 
4.2 Bargaining power of buyers 
4.3 Threat of substitutes 
4.4 Threat of new entrants 
4.5 Competitive rivalry 

5 Global Thermal Interface Material Market, By Type 
5.1 Introduction 
5.2 Thermal Pads 
5.3 Thermal Grease 
5.4 Phase Change Material 
5.5 Gap Fillers 
5.5 Metal-Based TIMS 

6 Global Thermal Interface Materials Market, By Product 
6.1 Introduction 
6.2 IGBT 
6.3 Power Transistors 
6.4 Thyristor 
6.5 Mosfet 

7 Global Thermal Interface Material Market, By Material Type 
7.1 Introduction 
7.2 Phase Change Material 
7.3 Gap Pads 
7.3.1 Elastomer 

8 Global Thermal Interface Material Market, By Application 
8.1 Introduction 
8.2 Power Supply Units 
8.3 Consumer Electronics 
8.4 Telecom Equipment 
8.5 Industrial Machinery 
8.6 Automotive Electronics 
8.7 Computers 
8.8 Medical Devices 
8.8 Others 

9 Global Thermal Interface Material Market, By Geography 
9.1 North America 
9.1.1 US 
9.1.2 Canada 
9.1.3 Mexico 
9.2 Europe 
9.2.1 Germany 
9.2.2 France 
9.2.3 Italy 
9.2.4 UK 
9.2.5 Spain 
9.2.6 Rest of Europe 
9.3 Asia Pacific 
9.3.1 Japan 
9.3.2 China 
9.3.3 India 
9.3.4 Australia 
9.3.5 New Zealand 
9.3.6 Rest of Asia Pacific 
9.4 Rest of the World 
9.4.1 Middle East 
9.4.2 Brazil 
9.4.3 Argentina 
9.4.4 South Africa 
9.4.5 Egypt 

10 Key Developments 
10.1 Agreements, Partnerships, Collaborations and Joint Ventures 
10.2 Acquisitions & Mergers 
10.3 New Product Launch 
10.4 Expansions 
10.5 Other Key Strategies 

11 Company Profiling 
11.1 Introduction 
11.2 Henkel AG & Co. KGAA 
11.3 DOW Corning Corporation 
11.4 3M Company 
11.5 Parker Hannifin Corporation 
11.6 Honeywell International Inc. 
11.7 Indium Corporation 
11.8 Momentive Performance Materials Inc. 
11.9 The Bergquist Company, Inc. 
11.10 Laird Technologies, Inc. 
11.11 Zalman Tech Co., Ltd. 
11.12 Fujipoly 
11.13 Graftech International Holdings Inc. 
11.14 Stockwell Elastomerics, Inc. 
11.15 Wakefield-Vette, Inc. 
11.16 MH&W International 

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