Wednesday, February 7th, 2018 - WiseGuyReports

Fan-out Wafer Level Packaging 2018

FOWLP is a chip packaging technology that is used to package an IC, while the IC is still part of the wafer. The technology has a smaller form factor, thinner flip-chip packages, supports I/O density, and allows the use of wafer level packaging with improved semiconductor technology nodes and multi-die package. Wafer-level packages have advantages, in terms of cost and form, in comparison to substrate-based flip-chip packages. The WLP can assemble small to medium pin count ICs in the thinnest and smallest possible footprint at low cost. This is driving its market demand.

The analysts forecast the global fan-out wafer level packaging market to grow at a CAGR of 47.76% during the period 2017-2021.

Covered in this report 
The report covers the present scenario and the growth prospects of the global fan-out wafer level packaging market for 2017-2021. To calculate the market size, the report presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources.

The market is divided into the following segments based on geography: 
• Americas 
• APAC 
• EMEA

 

Request a Sample Report @ https://www.wiseguyreports.com/sample-request/1120117-global-fan-out-wafer-level-packaging-market-2017-2021

 

The report, Global Fan-Out Wafer Level Packaging Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors 
• STATS ChipPAC 
• TSMC 
• Texas Instruments

Other prominent vendors 
• Rudolph Technologies 
• SEMES 
• SUSS MicroTec 
• STMicroelectronics 
• Ultratech

Market driver 
• Growing application of semiconductor ICs in IoT. 
• For a full, detailed list, view our report

Market challenge 
• Rapid technological changes in wafer processing. 
• For a full, detailed list, view our report

Market trend 
• High adoption of semiconductor ICs in automobiles. 
• For a full, detailed list, view our report

Key questions answered in this report 
• What will the market size be in 2021 and what will the growth rate be? 
• What are the key market trends? 
• What is driving this market? 
• What are the challenges to market growth? 
• Who are the key vendors in this market space? 
• What are the market opportunities and threats faced by the key vendors? 
• What are the strengths and weaknesses of the key vendors?

 

Complete Report Details @ https://www.wiseguyreports.com/reports/1120117-global-fan-out-wafer-level-packaging-market-2017-2021

 

Table of Contents –Analysis of Key Points

PART 01: Executive summary 
PART 02: Scope of the report 
PART 03: Research Methodology 
PART 04: Introduction 

• Key market highlights 
PART 05: Technology landscape 
• Semiconductor IC manufacturing process 
• WLP versus die-level packaging and assembly 
• Roadmap of semiconductor packaging industry 
• Ecosystem of semiconductor IC packaging industry 
PART 06: Market landscape 
• Market size and forecast 
• Five forces analysis 
PART 07: Market segmentation by application 
• Global FOWLP market by application 
• Analog and mixed IC 
• Wireless connectivity 
• Logic and memory IC 
• MEMS and sensors 
• CMOS image sensors 
PART 08: Geographical segmentation 
• APAC 
• Americas 
• Europe 
PART 09: Decision framework 
PART 10: Drivers and challenges 

• Market drivers 
• Impact of drivers on key customer segments 
• Market challenges 
• Impact of challenges on key customer segments 
PART 11: Market trends 
• Increase in wafer size 
• High adoption of semiconductor ICs in automobiles 
• Short replacement cycle of mobile devices 
PART 12: Vendor landscape 
• Competitive scenario 
• Key vendors 
• Other prominent vendors 

....Continued

 

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Norah Trent

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www.WiseGuyReports.com

Ph: +1-646-845-9349 (US)

Ph: +44 208 133 9349 (UK)

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Norah Trent
P: +44 208 133 9349
M: +1 646 845 9349
W: www.wiseguyreports.com/

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