Friday, February 2nd, 2018 - WiseGuyReports

Wafer Dicing Saws Market 2018

A dicing saw is a saw that is used to dice, groove, or cut semiconductor wafers by using a high-speed spindle that has been fitted with a diamond blade. A dicing saw is a part of a dicing machine, which cuts these wafers into individual chips. Some of the materials that can be diced using this machine are silicon, silicon carbide, gallium nitride, gallium arsenide, ceramic, sapphire, and glass. Dicing blades of varying thickness are used to saw the wafers based on the material being sawed. Dicing equipment can be categorized into three types, namely sawing equipment, scribing equipment, and sawing accessories. Sawing accessories consist of breaking, mounting, and surface grinding.

The analysts forecast the global wafer dicing saws market to grow at a CAGR of 6.35% during the period 2017-2021.

Covered in this report 
The report covers the present scenario and the growth prospects of the global wafer dicing saws market for 2017-2021. To calculate the market size, the report considers the revenues from major wafer dicing saws vendors..

The market is divided into the following segments based on geography: 
• Americas 


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The report, Global Wafer Dicing Saws Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors 
• DISCO Corporation 
• Advanced Dicing Technology 
• Dynatex International 
• Loadpoint 
• Micross Components

Market driver 
• Growing demand for IoT 
• For a full, detailed list, view our report

Market challenge 
• Volatile nature of the semiconductor industry 
• For a full, detailed list, view our report

Market trend 
• Growth of AI 
• For a full, detailed list, view our report

Key questions answered in this report 
• What will the market size be in 2021 and what will the growth rate be? 
• What are the key market trends? 
• What is driving this market? 
• What are the challenges to market growth? 
• Who are the key vendors in this market space? 
• What are the market opportunities and threats faced by the key vendors? 
• What are the strengths and weaknesses of the key vendors?


Complete Report Details @


Table of Contents –Analysis of Key Points

PART 01: Executive summary 
PART 02: Scope of the report 
PART 03: Research Methodology 
PART 04: Introduction 

• Market outline 
• Wafer dicing saws 
PART 05: Market landscape 
• Market overview 
• Market size and forecast 
PART 06: Five forces analysis 
• Five forces analysis 
PART 07: Market segmentation by end-user 
• Pureplay foundries 
• IDMs 
• PART 08: Market segmentation by packaging technology 
• BGA 
• QFN 
PART 09: Geographical segmentation 
• Market overview 
• Americas 
PART 10: Key leading countries 
• Taiwan 
• China 
• Decision framework 
PART 11: Drivers and challenges 
• Market drivers 
• Market challenges 
PART 12: Market trends 
• Growth of AI 
• Increase in wafer size 
• Introduction of ultrasonic blade dicing 
• Growth of smart cities 
PART 13: Vendor landscape 
• Competitive scenario 
PART 14: Key vendor analysis 
• DISCO Corporation 
• Advanced Dicing Technology 
• Dynatex International 
• Loadpoint 
• Micross Components 




Norah Trent

Partner Relations & Marketing Manager

[email protected]

Ph: +1-646-845-9349 (US)

Ph: +44 208 133 9349 (UK)

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Norah Trent
P: +44 208 133 9349
M: +1 646 845 9349


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