The potting compound market size will reach $3.13 billion by 2021, registering a CAGR of 3.7% between 2016 and 2021. With emerging economies of Asia-Pacific, Latin America, and Central & Eastern Europe major economies, such as India, Indonesia, Malaysia, Singapore, Brazil, Argentina, and Turkey, the market is expected to grow further. Increasing demand from the consumer electronics industry is the major driver for the potting compound market. The global potting compound market is expected to rise with the growing demand from various end-use industries. The transportation industry is another major segment boosting the growth of potting compound, globally. Complete report on global potting compound market spread across 280 pages, profiling 10 companies and supported with 258 tables and 49 figures is now available at http://www.rnrmarketresearch.com/potting-compound-market-by-type-epoxy-resin-polyurethane-resin-silicone-resin-polyester-system-and-polyamide-by-application-electrical-and-electronics-and-by-region-global-trends-forecast-to-2021-market-report.html .
The global potting compound market is expected to rise with the growing demand from various end-use industries due to the increasing miniaturization of electronics and increasing demand from the consumer electronics industry with china being expected to be the most dominant market.
Asia-Pacific is the largest potting compound market globally, with China being the most dominant market. This region is witnessing the highest growth rate, and this high growth is attributed to the rapid economic expansion currently undergoing in the region. The demand for potting compound is highly dependent on the economic growth of a region. Further, rapid industrial development in Asia-Pacific is vigorously driving the demand for potting compound in electronics, transportation, and other applications.
The potting compound market report provides company profiles and competitive strategies adopted by the major market players such as ACC Silicones Ltd. (U.K.), Dymax Corporation (U.S.), EFI Polymers (U.S.), Elantas Beck India Ltd. (India), Electrolube (U.K.), Epic Resins (U.S.), Intertronics (U.K.), Master Bond Inc. (U.S.), MG Chemicals (Canada), and Henkel AG & Co. KGaA (Germany) among others. Make an Inquiry on “Potting Compound Market by Type (Epoxy Resin, Polyurethane Resin, Silicone Resin, Polyester System, and Polyamide) by Application (Electrical and Electronics) and by Region - Global Trends & Forecast to 2021” research report at http://www.rnrmarketresearch.com/contacts/inquire-before-buying?rname=604871 .
The electronics sector is projected to be fastest-growing application of potting compound market between 2016 and 2021. Potting compounds are used widely for electronics application in various end-use industries such as consumer electronics, transportation, energy & power, solar power, and others. As potting compounds are characterized to provide protection from harsh environmental conditions and have properties such as heat dissipation, flame retardancy or vibration resistance, they are the ideal materials for electronics applications.
To determine the market size of various segments and sub-segments of the potting compound market, extensive secondary research is done. In the process of determining and verifying, the market size for several segments and sub segments gathered through secondary research, extensive primary interviews were conducted with key people. In Tier 1 (20%), Tier 2 (20%) and Tier 3 (60%) companies were contacted for primary interviews. The interviews were conducted with various key people such as C-level Executives (20%), Directors Level (20%) and others (60%) from various key organizations operating in the global potting compound market. The primary interviews were conducted worldwide covering regions such as North America (40%), Europe (40%), and APAC (20%).
On a related note, another research on Molding Compound Market Global Forecasts to 2020 says, the molding compounds market by thermoset resin type to grow from $8.04 billion in 2015 to $10.96 billion by 2020, at a CAGR of 6.40% between 2015 and 2020. Electrical application accounts for the largest market share in molding compound market by thermoset resin type. Phenolic molding compounds to register maximum growth during the forecast period. Companies like Hexion Inc., Hitachi Chemical Company, BASF SE, Huntsman International LLC, Eastman Chemical Company, Kyocera Chemical Corporation, Evonik Industries, Kolon Industries, Ashland Inc., and Kukdo Chemicals Company have been profiled in this 121 pages research report available at http://www.rnrmarketresearch.com/molding-compound-market-by-thermoset-resin-type-phenolic-epoxy-polyester-and-others-by-applications-electricals-aerospace-automotive-and-others-and-by-region-global-forecasts-to-2020-market-report.html .
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