Wednesday, October 20th, 2010 - DesignArt Networks
SoC Platform Eliminates Roadblocks to Multi-Gigabit Radio Access Networks

CHICAGO, IL--(Marketwire) - 4G World -- DesignArt Networks today announced that its new and disruptive DAN3000 4G SoC family employs multiple customized processor cores from Tensilica®, Inc. The result is the first fully integrated 40nm multi-layer, multi-core SoC platform, delivering more than 1 Gbps in mobile broadband data throughput, ready for LTE Advanced applications. With the DAN3000 SoC family, DesignArt Networks integrated all radio access network (RAN) processing layers into one single-SoC architecture, eliminating cost, size and performance roadblocks to multi-gigabit 4G broadband services.

"Tensilica's customizable dataplane processor (DPU) cores gave us the ability to create a highly integrated multi-layer SoC architecture, maintaining full software flexibility at unrestricted 4G performance levels, yielding the highest number of MIPS per Watt in the market," said Assaf Touboul, DesignArt Networks CTO. "The customization capability of Tensilica's DPU cores enabled us to design a DSP architecture that is custom-built for advanced 3G and 4G signal processing performance. Without this capability it would not have been possible to develop such a powerful, yet efficient, multi-layer system-on-chip architecture."

"The DAN3000 SoC platform is a breakthrough device that provides equipment vendors with a future-proof, software-defined, integrated development platform," said Eric Dewannain, Tensilica's vice president and general manager of the baseband business unit. "This SoC design exemplifies what designers with deep knowledge of application-specific product requirements can achieve with our customizable dataplane processor IP cores."

The DAN3000 SoC platform can replace several FPGA, DSP and Network Processor components, and in some cases, even multiple baseband cards, with a single-chip SoC design. This eliminates multiple vendor-specific development frameworks, providing a single integrated development environment (IDE), while offering state-of-the art multi-core simulation and debugging tools, as well as a single structured C/C++ programming model. Moreover, as the first fully software-defined multi-layer, multi-core SoC architecture, the DAN3000 SoC family provides a single integrated development framework for all RAN product segments, ranging from traditional BTS, BBU, RRH, and Mobile Backhaul equipment, to next-generation Compact BTS equipment.

Contact Profile

DesignArt Networks


DesignArt Networks Ltd. is the leading supplier of highly integrated System-on-Chip (SoC) infrastructure solutions for the evolving mobile radio access network. Based on a unique multi-layer, multi-core architecture, DAN open SoC platforms integrate in a single SoC product all four processing layers required for the design of any type of mobile radio access network (RAN) infrastructure product, ranging from base stations, radio heads, backhaul systems, and up to fully integrated multi-sector 4G base station systems with zero-cost self-backhaul -- on one chip. DesignArt provides a single powerful integrated system development framework, including full-featured and trial-ready software applications. Vendors benefit from the resulting low-cost, yet powerful and flexible product portfolio, while drastically reducing R&D and life-cycle expenses, and optimizing time-to-market. Operators benefit from best-of-breed, yet compact RAN equipment with an absolute minimum of power consumption. For more information, visit www.designartnetworks.com.
Erika Powelson
P: (831) 424-1811
W: www.designartnetworks.com

Tensilica


Tensilica, Inc. is the leader in customizable dataplane processor IP cores. Dataplane Processor Units (DPUs) combine the best capabilities of CPUs and DSPs while delivering 10 to 100x the performance because they can be customized using Tensilica's automated design tools to meet specific signal processing performance targets. Tensilica's DPUs power SOC designs at system OEMs and six out of the top 10 semiconductor companies for products including mobile phones, consumer electronics devices (including digital TV, Blu-ray Disc players, broadband set top boxes, digital still cameras and portable media players), computers, and storage, networking and communications equipment. For more information on Tensilica's patented, benchmark-proven DPUs visit www.tensilica.com.

Trademarks:
All trademarks, registered trademarks and service marks are the property of DesignArt Networks and Tensilica, Inc. All other trademarks are the property of their respective owners.

Press Contact:
Karen Quatromoni
(508) 475-0025 x150
[email protected]

Paula Jones
P: (408) 327-7343
W: www.tensilica.com

Keywords

first fully integrated 40nm multi-layer, multi-core SoC platform, delivering more than 1 Gbps in mobile broadband data throughput, ready for LTE Advanced applications

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