ReportsnReports.com adds Global Semiconductor Packaging Materials Market 2016-2020 latest research report, the semiconductor industry is facing many changes in technology, including the introduction of 3D ICs, including 3D NAND, FinFETs, and stacked dies. The increase in demand for multifunctional and high-performance ICs in electronic devices is driving the need for regular technological upgrades. 3D ICs are an ideal solution to meet the growing demand for smaller and higher-performance ICs in the consumer electronics segment. 3D NAND is another technology that provides a large memory storage area in minimal space; this technology will likely capture 54.82% of the total NAND market by the end of 2020. The analysts forecast global semiconductor packaging materials market to grow at a CAGR of 4.79% during the period 2016-2020.
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According to the semiconductor packaging materials market report, demand for polymer adhesive wafer bonding equipment is rising due to the increasing adoption of advanced packaging applications like TSV, 2.5D and 3D ICs, stacked die packaging, and MEMS packaging. Polymer adhesive wafer bonding equipment provides reliable thinning and backside processing of the stacked dies. In addition, it lowers the cost of TSV (through-silicon via) integration. The rising demand for polymer adhesive wafer bonding equipment will, therefore, have a moderately high impact on the market for semiconductor devices as this equipment supports 3D packaging, which is the future of the semiconductor packaging and assembly industry.
Segmentation by type of material and analysis of the semiconductor packaging materials market
Die attach materials
The organic substrates segment is the largest in the semiconductor packaging materials market and is expected to generate revenues of over USD 14 billion by the end of the forecast period. As these materials form the base layers of individual semiconductor devices and chips on which other layers are deposited to complete the circuit, they are increasingly preferred over other materials like lead frames as the industry is decreasing the use of lead.
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The APAC region was the market leader for the semiconductor packaging materials in 2015 with a market share of just over 93% and will remain so for the foreseeable future. This market will grow at a CAGR of close to 5% during the forecast period. The APAC market is home to manufacturing giants in countries like China, Japan, South Korea, and Taiwan. The market will experience robust growth due to increased demand for smart mobile devices and other electronic goods during the forecast period.
The global semiconductor packaging materials market is highly fragmented with a number of multinational, regional, and local providers. This market is dominated by manufacturers in the APAC region. Local players are raising the stakes by offering innovative solutions at lower prices than international vendors through re-engineering and other methods. Small and local vendors compete on the basis of cost with international vendors. Growth in this market will be inorganic, mostly by M&As of small vendors by international companies.
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Key players in the global Semiconductor Packaging Materials market: Amkor Technology, DuPont, Henkel, Hitachi Chemical, Honeywell, KYOCERA, and Toppan Printing.
Other Prominent Vendors in the market are: Alpha Advanced Materials, Applied Materials, ASM Pacific Technology (ASMPT), BASF, Beijing Doublink Solders, Beijing Kehua New Chemical Technology, Cheil Industries, Duksan Hi-metal, Diehl Metall, Dynacraft, Evergreen Semiconductor Materials, Guangdong Rongtai, Heesung Metal, Heraeus, Ibiden, Indium, IQE, KCC, LG Innotek, Lintec, Lord, Mitsui High-Tec, MK Electron, Nanya PCB, Ningbo Dongsheng IC, Nippon Micrometal, Nitto Denko, Poongsan, Samsung Techwin, Shinko, Shin-Etsu Chemical, Shanghai Sinyang Semiconductor Materials, Sumitomo Metal Mining, Tanaka Denshi Kogyo, Tatsuta Electronic Materials, and Xiamen Yonghong Electronics.
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