Tuesday, November 15th, 2011 - Cadence
Cadence, TSMC Collaborate on Silicon Interposer TSV Test Vehicle Using Cadence 3D-IC Products

SAN JOSE, CA--(Marketwire - November 14, 2011) - Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that TSMC has recognized Cadence with a TSMC EDA Partner Award for its 3D-IC technology. The award underscores the R&D investment from Cadence for this emerging technology, which will drive advances in IC and packaging to enhance performance and reduce power consumption, size and weight as the electronics industry moves into a new era of ultra portable devices.

Cadence was cited for helping implement an interposer test vehicle using Cadence standard 3D-IC solutions that employed through-silicon vias (TSV). The project involved a system-on-chip (SoC) and eDRAM integrated on a silicon interposer.

"Our in-depth collaborations with TSMC across many advanced projects in the IC domains had enabled TSMC and Cadence to take the leadership in 3D-IC," said Dr. Chi-Ping Hsu, senior vice president, research and development, Silicon Realization Group at Cadence. "With the complexity levels faced by today's chip design to deliver features along with performance, power and form factor goals, new approaches are needed to stay competitive, and 3D-IC is an important industry direction for addressing those challenges. We appreciate the recognition from TSMC and look forward to enabling the semiconductor industry with this important new technology."

"We are pleased to recognize the contributions Cadence has made in the field of 3D-IC," said Suk Lee, TSMC Director of Design Infrastructure Marketing. "The deployment of these new technologies will continue to drive the expansion of computing power and performance."

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Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at www.cadence.com.

Cadence and the Cadence logo are registered trademarks of Cadence Design Systems, Inc. in the United States and other countries. All other trademarks are the property of their respective owners.

For more information, please contact:
Dean Solov
Cadence Design Systems, Inc.
408-944-7226
[email protected]

Dean Solov, Cadence Design Systems, Inc.
P: 408-944-7226
W: www.cadence.com

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Cadence, TSMC Collaborate on Silicon Interposer TSV Test Vehicle Using Cadence 3D-IC Products

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